Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2009-03-17
2010-10-26
Le, Thao X (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S076000, C257S686000, C257SE23042, C438S123000, C438S109000
Reexamination Certificate
active
07821114
ABSTRACT:
Disclosed in this specification is a multiphase buck converter package and process for forming such package. The package includes at least four dice and several parallel leads. The dice are electrically connected through a plurality of die attach pads, thus eliminating the need for wirebonding.
REFERENCES:
patent: 6043430 (2000-03-01), Chun
patent: 6803750 (2004-10-01), Zhang
patent: 2007/0249092 (2007-10-01), Joshi
patent: 2008/0061396 (2008-03-01), Havanur
patent: 2009/0189262 (2009-07-01), Liu et al.
Liu Yong
Maldo Tiburcio A.
Yang Hua
Arora Ajay K.
Fairchild Semiconductor Corporation
Hiscock & Barclay LLP
Le Thao X
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