Multiple chip hybrid package using bump technology

Details Multiple chip hybrid package using bump technology Multiple chip hybrid package using bump technology

1998-02-27

2000-08-08

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

257685, 257686, 257778, H01L 2348, H01L 2352, H01L 2940

Patent

active

061005932

ABSTRACT:
A multiple chip hybrid package using bump technology having multiple chips electrically connected using a flip chip technology such as solder bump technology. Portion of at least one chip is electrically connected to electrical leads connecting terminals inside the package to pins outside the package.

REFERENCES:
patent: 4074342 (1978-02-01), Honn et al.
patent: 5266912 (1993-11-01), Kledzik
patent: 5404044 (1995-04-01), Booth

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