Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1997-11-12
1999-12-14
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257693, 257777, 257723, 257 48, H01L 2348, H01L 2352, H01L 2940
Patent
active
060021780
ABSTRACT:
The present invention discloses a chip-size package (CSP) ready multiple chip module (MCM) board having a top surface and a bottom surface for mounting and packaging a plurality of integrated circuit (IC) chips on the top surface. The MCM board is provided with a plurality of chip connection terminals on the top surface for electrically connecting to the IC chips. The MCM board further includes a plurality of via connectors in electrical connection with each of the MCM connection terminals. The MCM board further includes a plurality of CSP connection terminals disposed on the bottom surface substantially under the IC chips wherein each of the via connectors penetrating the MCM board for electrically connecting the CSP connection terminals to the MCM connection terminals.
REFERENCES:
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5654590 (1997-08-01), Kuramochi
Clark Jhihan B
Lin Bo-In
Saadat Mahshid
LandOfFree
Multiple chip module configuration to simplify testing process a does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multiple chip module configuration to simplify testing process a, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple chip module configuration to simplify testing process a will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-866232