Multiple chip module apparatus having dual sided substrate

Details Multiple chip module apparatus having dual sided substrate Multiple chip module apparatus having dual sided substrate

1996-12-20

1998-08-25

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257723, H01L 2302

Patent

active

057985642

ABSTRACT:
The invention is to a double side semiconductor module (10) and an array (40) made up of a plurality of stacked modules (10). Each module (10) includes a plurality of substrates (11-15). A first substrate (13) has first and second sides, with one semiconductor device (16,25) having bond pads thereon (17,26), mounted on each of said first and second sides. At least one additional substrate (12,14) having a central opening (12b,14b), is placed on each of said first and second sides with the semiconductor device (16,25) mounted in the central opening (12b,14b). A plurality of solder pins (11a-15a), associated with each of said substrates (11-15) are connected to contact pads (17,26) on the semiconductor devices (16,25), and extend from and to openings in said substrates (11-15).

REFERENCES:
patent: 5231304 (1993-07-01), Solomon
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5440171 (1995-08-01), Miyano et al.
patent: 5481133 (1996-01-01), Hsu

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