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Multi-chip semiconductor device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Multi-chip semiconductor device with specific chip arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Multi-chip semiconductor encapsulation method and its finished p

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Patent

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Multi-chip semiconductor LED assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate

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Multi-chip semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Multi-chip semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

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Multi-chip semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Multi-chip semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Multi-chip semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Multi-chip semiconductor package and fabrication method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Multi-chip semiconductor package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Multi-chip semiconductor package with heat dissipating...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Multi-chip semiconductor package with integral shield and...

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding – With means to shield device contained in housing or package...
Reexamination Certificate

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Multi-chip semiconductor package with integral shield and...

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Multi-chip stack and method of fabrication utilizing...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Multi-chip stack flip-chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Multi-chip stack package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Multi-chip stacked devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

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Multi-chip stacked devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Multi-chip stacked package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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