Multi-chip semiconductor package structure

Details Multi-chip semiconductor package structure Multi-chip semiconductor package structure

2005-01-18

2005-01-18

Thompson, Craig A. (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

active

06844616

ABSTRACT:
A multi-chip semiconductor package structure. The structure includes two chips and two lead frames. The leads on one of the lead frames have inner leads at one end and joint sections at the other end. The joint sections are connected with another lead frame. Both lead frames use a common set of external leads. The two chips and two lead frames are joined together forming a lead-on-chip structure with the two chips facing each other back-to-back. The assembly except the external leads is enclosed by packaging material.

REFERENCES:
patent: 5701031 (1997-12-01), Oguchi et al.
patent: 6252299 (2001-06-01), Masuda et al.
patent: 6337521 (2002-01-01), Masuda
patent: 6383845 (2002-05-01), Masuda et al.
patent: 6410365 (2002-06-01), Kawata et al.

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