Multi-chip semiconductor package with integral shield and...

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding – With means to shield device contained in housing or package...

Reexamination Certificate

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C257S659000, C257S690000

Reexamination Certificate

active

07049682

ABSTRACT:
A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.

REFERENCES:
patent: 4868639 (1989-09-01), Mugiya et al.
patent: 5166772 (1992-11-01), Soldner et al.
patent: 6225694 (2001-05-01), Terui
patent: 6472598 (2002-10-01), Glenn
patent: 6476463 (2002-11-01), Kaneko et al.
patent: 2002/0167060 (2002-11-01), Buijsman et al.
patent: WO 02/071547 (2002-02-01), None

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