Multi-chip stack flip-chip package

Details Multi-chip stack flip-chip package Multi-chip stack flip-chip package

2005-03-01

2005-03-01

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S778000, C257S737000, C257S738000, C438S108000

Reexamination Certificate

active

06861761

ABSTRACT:
A multi-chip stack flip-chip package comprises a substrate and a chip assembly on the substrate. The chip assembly includes a dummy chip and a flip chip. The dummy chip has a redistribution layer that has a plurality of bump pads for mounting the flip chip, a plurality of peripheral pads for electrically connecting to the substrate, and a plurality of integrated circuit traces connecting the bump pads with the peripheral pads. The dummy chip is disposed between the flip chip and the substrate as an electrically connecting interface between the flip chip and the substrate for multi-chip flip-chip stack and fine pitch flip-chip mounting.

REFERENCES:
patent: 5616520 (1997-04-01), Nishiuma et al.
patent: 5923090 (1999-07-01), Fallon et al.
patent: 6175157 (2001-01-01), Morifuji
patent: 6414384 (2002-07-01), Lo et al.
patent: 6462420 (2002-10-01), Hikita et al.
patent: 6503776 (2003-01-01), Pai et al.
patent: 6507098 (2003-01-01), Lo et al.

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