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Heat sink formed of multiple metal layers on backside of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Heat sink having good heat dissipating characteristics

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Heat sink material

Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than...
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Heat sink material and method of manufacturing the heat sink...

Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than...
Reexamination Certificate

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Heat sink mounting system for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Heat sink packaging assembly for electronic components

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Heat sink substrate consisting essentially of copper and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Heat sink unit for cooling a plurality of exothermic units,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Heat sink with collapse structure and semiconductor package...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat sink with collapse structure for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Heat sink with cooling fins for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Heat sink with elevated heat spreader lid

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat sink with preattached thermal interface material and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Heat sink with thermally compliant beams

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat sinks

Active solid-state devices (e.g. – transistors – solid-state diode – Organic semiconductor material
Reexamination Certificate

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Heat sinks including nonlinear passageways

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Temperature
Reexamination Certificate

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Heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Heat spreader and package structure utilizing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Heat spreader and package structure utilizing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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