Heat sinks

Details Heat sinks Heat sinks

2006-09-19

2006-09-19

Baumeister, B. William (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Organic semiconductor material

C257SE51018

Reexamination Certificate

active

07109520

ABSTRACT:
An aspect of the present invention provides a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a thickness no greater than 9 mm. In another embodiment, a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a ratio of area:thickness, as seen from a plan view, of at least 500:1 when the area and thickness are expressed in units of mm2and mm, respectively.

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