Heat sink with thermally compliant beams

Details Heat sink with thermally compliant beams Heat sink with thermally compliant beams

2009-08-07

2010-11-16

Dang, Phuc T (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S724000

Reexamination Certificate

active

07834445

ABSTRACT:
A heat dissipating structure includes: a heat spreader; and a plurality of compliant beams attached to the heat spreader. The beams are formed of a high-conductive material such that a maximum stress of each beam is less than a fatigue stress of the high-conductive material; said beams are placed at an angle relative to a chip surface such that the beams are able to exert bending compliance in response to x, y, and z forces exerted upon them. The structure also includes a thermal material interface for bonding said structure to the chip surface. Both the heat spreader and the compliant beams can be machined from a copper block. An alternative heat dissipating structure includes compliant beams soldered to the chip surface.

REFERENCES:
patent: 5430611 (1995-07-01), Patel et al.
patent: 5579205 (1996-11-01), Tustaniwskyj et al.
patent: 6064573 (2000-05-01), Morton
patent: 6545352 (2003-04-01), Ruckdeschel
patent: 6851120 (2005-02-01), Crane et al.

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