Heat spreader and package structure utilizing the same

Details Heat spreader and package structure utilizing the same Heat spreader and package structure utilizing the same

2008-05-27

2008-05-27

Tran, Thien F (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S796000, C257SE23087

Reexamination Certificate

active

11705130

ABSTRACT:
A heat spreader and package structure utilizing the same. The heat spreader is embedded in an encapsulant of a package and above a chip therein, wherein the package has a substrate, having a molding gate, and the chip has a center and a corner which is the farthest from the molding gate. The spreader includes a base with a hollow portion therethrough, a plurality of support leads, protruding from the base, on the inner edge, and a cap plate, having a hole at least directly above a region between the center and the corner of the chip, fixed by the support leads to be above the hollow portion, the cap plate.

REFERENCES:
patent: 6191360 (2001-02-01), Tao et al.
patent: 2005/0139997 (2005-06-01), Chou

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