Heat sink material

Details Heat sink material Heat sink material

2005-08-09

2005-08-09

Turner, Archene (Department: 1775)

Active solid-state devices (e.g., transistors, solid-state diode

Specified wide band gap semiconductor material other than...

C428S408000, C428S469000, C428S446000, C428S698000

Reexamination Certificate

active

06927421

ABSTRACT:
A mass of graphite is placed into a case, and the case is put into a furnace (step S301). The space in the furnace is heated to produce a porous sintered body of graphite (step S302). Thereafter, the case with the porous sintered body contained therein is removed from the furnace, and put into a cavity in a press (step S303). Then, a molten mass of a metal is poured into the case (step S304), and a punch is inserted into the cavity to press the molten metal into the porous sintered body in the case (step S305).

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U.S. Appl. No. 09/913,353, filed Aug. 13, 2001, Ishikawa et al.

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