LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Ball grid array package-to-board interconnect co-design...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Ball grid array packages for high speed applications

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Ball grid array packages with thermally conductive containers

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Ball grid array resistor network

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond

Ball grid array semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Ball grid array semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Ball grid array semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Ball grid array semiconductor package and substrate therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array semiconductor package and substrate without...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Ball grid array semiconductor package comprised of two lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array semiconductor package with improved strength...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array semiconductor package with resin coated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array socket having improved housing

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array structure and method for packaging an integrated

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array structure and method for packaging an integrated

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array structures and tape-based method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array structures and tape-based method of...