Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1997-03-06
1999-11-30
Kelley, Nathan K.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257668, 257692, H01L 2314
Patent
active
059947730
ABSTRACT:
A ball grid array semiconductor package includes an insulative base material; circuitry metallizations formed on a first surface of the material, each metallization having a grid pad electrode; and a semiconductor chip mounted on the first surface and electrically connected to the circuitry metallizations. The base material is opened from a second surface of the base material at a location under each grid pad electrode; and each opening confines a portion of a solder ball which is in melt-fixed connection to a back side of each grid electrode.
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John H. Lau; "Ball Grid Array Technology"; 1995; Frontispiece/pp. 29-30.
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