Ball grid array semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

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Details

257668, 257692, H01L 2314

Patent

active

059947730

ABSTRACT:
A ball grid array semiconductor package includes an insulative base material; circuitry metallizations formed on a first surface of the material, each metallization having a grid pad electrode; and a semiconductor chip mounted on the first surface and electrically connected to the circuitry metallizations. The base material is opened from a second surface of the base material at a location under each grid pad electrode; and each opening confines a portion of a solder ball which is in melt-fixed connection to a back side of each grid electrode.

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John H. Lau; "Ball Grid Array Technology"; 1995; Frontispiece/pp. 29-30.

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