Ball grid array semiconductor device

Details Ball grid array semiconductor device Ball grid array semiconductor device

1998-09-11

2000-02-22

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

257738, 257780, H01L 2348

Patent

active

060283661

ABSTRACT:
The present invention provides a land comprising a recess formed in a packaging portion for receiving a solder ball. The land has a main part having a size which is slightly larger than a size of the solder ball for receiving the solder ball, wherein the land further has at least a flux-escape part extending outwardly from the main part so as to form a sufficient space for allowing any excess amount of a flux to escape into the flux-escape region.

REFERENCES:
patent: 5316788 (1994-05-01), Dibble et al.
patent: 5480835 (1996-01-01), Carney et al.
patent: 5519580 (1996-05-01), Natarajan et al.
patent: 5523920 (1996-06-01), Machuga et al.
patent: 5889655 (1999-03-01), Barrow

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