Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-05-15
2007-05-15
Tran, Minh-Loan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S700000, C257S737000, C257SE23067, C257SE23069
Reexamination Certificate
active
11078164
ABSTRACT:
A ball grid array (BGA) socket includes an insulative housing (11), a number of terminals (12) and a protecting device (114). The insulative housing includes a mating surface (111), a mounting surface (112) opposite to mating surface, a plurality of passageways (113) extending between the mating surface and the mounting surface and a plurality of electrical terminals (12) received in the passageways. Each of the terminals includes a body portion (121); a contacting portion (122) extending forwardly from the body portion and a soldering portion (123) extending downwardly from the body portion and extending beyond the mounting surface of the insulative housing. The protecting device is arranged on the mounting surface. In a perpendicular direction, a distance between a bottom surface of the protecting device and the mounting surface is longer or equal to another distance between soldering portion and the mounting surface.
REFERENCES:
patent: 6116922 (2000-09-01), Szu et al.
patent: 6362437 (2002-03-01), Arai
patent: 6438826 (2002-08-01), Takase et al.
patent: 6558170 (2003-05-01), Lemke
Cheng Jun
Ye Hui
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