Ball grid array package-to-board interconnect co-design...

Details Ball grid array package-to-board interconnect co-design... Ball grid array package-to-board interconnect co-design...

2008-07-29

2008-07-29

Menz, Doug (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

C257S729000, C257S730000, C257S659000, C257S660000, C257SE23069, C361S770000, C361S794000

Reexamination Certificate

active

07405477

ABSTRACT:
A package-board co-design methodology preserves the signal integrity of high-speed signals passing from semiconductor packages to application PCBs. An optimal architecture of interconnects between package and PCB enhances the signal propagation, minimizes parasitic levels, and decreases electromagnetic interference from adjacent high frequency signals. The invention results in devices with superior signal quality and EMI shielding properties with enhanced capability for carrying data stream at multiple-gigabit per second bit-rates.

REFERENCES:
patent: 5216278 (1993-06-01), Lin et al.
patent: 5796589 (1998-08-01), Barrow
patent: 6125042 (2000-09-01), Verdi et al.

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