Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-07-17
2007-07-17
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S780000, C257S784000, C257S787000, C257SE23116, C438S109000, C438S127000, C438S617000
Reexamination Certificate
active
10879066
ABSTRACT:
A BGA package including a substrate, a plurality of solder balls on the semiconductor and an encapsulant, which leaves the solder balls partially exposed on the semiconductor chip, thereby reducing the size of the BGA package. In addition, an edge of the substrate may extend beyond an edge of the semiconductor chip. Stacked BGA packages and methods of manufacturing a BGA (or stacked BGA) package are also disclosed.
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Korean Office Action issued Sep. 30, 2005 (Korean and English translation).
Harness & Dickey & Pierce P.L.C.
Parekh Nitin
Samsung Electronics Co,. Ltd.
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