Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1995-10-17
1998-06-16
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257738, 257760, H01L 2312
Patent
active
057675759
ABSTRACT:
An integrated circuit (IC) package substrate has a dielectric layer and a micro filled via formed substantially in the center of a hole in the dielectric layer. The IC package substrate has at least one chip bonding pad and one ball attach pad that are electrically coupled to each other by the micro filled via. The micro filled via is formed of a material called a "micro filled via material" that includes a binding material and optionally includes a number of particles (between 0%-90% by volume) dispersed in the binding material. The binding material can be any material, such as a polymer that is either conductive or nonconductive. The particles can be formed of any conductive material, such as a conductive polymer or a conductive metal (e.g. copper or gold). An electrical conductor can be originally formed simply by contact between conductive particles located adjacent to each other. In an optional step, the micro filled via is subjected to a programming current (in a step called "programming") to lower the resistance of an originally formed electrical conductor, or to originally form an electrical conductor by break down of a dielectric material. The IC package substrate can be formed in either a cavity up or a cavity down configuration.
REFERENCES:
patent: 3335327 (1967-08-01), Damon et al.
patent: 3384879 (1968-05-01), Stahl et al.
patent: 3615913 (1971-10-01), Shaw
patent: 3808576 (1974-04-01), Castonguay et al.
patent: 3857683 (1974-12-01), Castonguay
patent: 3923359 (1975-12-01), Newsam
patent: 4090667 (1978-05-01), Crimmins
patent: 4146863 (1979-03-01), Mollenhoff
patent: 4238839 (1980-12-01), Redfern et al.
patent: 4245273 (1981-01-01), Feinberg et al.
patent: 4247981 (1981-02-01), Walters
patent: 4386051 (1983-05-01), Edgington
patent: 4399372 (1983-08-01), Tanimoto et al.
patent: 4413272 (1983-11-01), Mochizuki et al.
patent: 4420820 (1983-12-01), Preedy
patent: 4424578 (1984-01-01), Miyamoto
patent: 4433331 (1984-02-01), Kollaritsch
patent: 4455495 (1984-06-01), Masuhara et al.
patent: 4458297 (1984-07-01), Stopper et al.
patent: 4488262 (1984-12-01), Basire et al.
patent: 4491860 (1985-01-01), Lim
patent: 4507756 (1985-03-01), McElroy
patent: 4507757 (1985-03-01), McElroy
patent: 4547830 (1985-10-01), Yamauchi
patent: 4562639 (1986-01-01), McElroy
patent: 4565712 (1986-01-01), Noguchi et al.
patent: 4566186 (1986-01-01), Bauer et al.
patent: 4569120 (1986-02-01), Stacy et al.
patent: 4569121 (1986-02-01), Lim et al.
patent: 4585490 (1986-04-01), Raffel et al.
patent: 4590589 (1986-05-01), Gerzberg
patent: 4609241 (1986-09-01), Peterson
patent: 4642160 (1987-02-01), Burgess
patent: 4651409 (1987-03-01), Ellsworth et al.
patent: 4652974 (1987-03-01), Ryan
patent: 4678889 (1987-07-01), Yamanaka
patent: 4689411 (1987-08-01), Dick et al.
patent: 4700116 (1987-10-01), Inoue et al.
patent: 4700214 (1987-10-01), Johnson
patent: 4710592 (1987-12-01), Kimbara
patent: 4721868 (1988-01-01), Cornell et al.
patent: 4726991 (1988-02-01), Hyatt et al.
patent: 4731704 (1988-03-01), Lochner
patent: 4748490 (1988-05-01), Hollingsworth
patent: 4757359 (1988-07-01), Chiao et al.
patent: 4780670 (1988-10-01), Cherry
patent: 4786904 (1988-11-01), Graham, III et al.
patent: 4789760 (1988-12-01), Koyama et al.
patent: 4791075 (1988-12-01), Lin
patent: 4792646 (1988-12-01), Enomoto
patent: 4792835 (1988-12-01), Sacarisen et al.
patent: 4796074 (1989-01-01), Roesner
patent: 4796075 (1989-01-01), Whitten
patent: 4799128 (1989-01-01), Chen
patent: 4803595 (1989-02-01), Kraus et al.
patent: 4808967 (1989-02-01), Rice et al.
patent: 4821142 (1989-04-01), Ushifusa et al.
patent: 4823181 (1989-04-01), Mohsen et al.
patent: 4829404 (1989-05-01), Jensen
patent: 4839864 (1989-06-01), Fujishima
patent: 4840924 (1989-06-01), Kinbara
patent: 4841099 (1989-06-01), Epstein et al.
patent: 4845315 (1989-07-01), Stopper
patent: 4847732 (1989-07-01), Stopper et al.
patent: 4864165 (1989-09-01), Hoberman et al.
patent: 4873506 (1989-10-01), Gurevich
patent: 4874711 (1989-10-01), Hughes et al.
patent: 4876220 (1989-10-01), Mohsen et al.
patent: 4881114 (1989-11-01), Mohsen et al.
patent: 4882611 (1989-11-01), Blech et al.
patent: 4888574 (1989-12-01), Rice et al.
patent: 4888665 (1989-12-01), Smith
patent: 4892776 (1990-01-01), Rice
patent: 4893167 (1990-01-01), Boudou et al.
patent: 4897836 (1990-01-01), Fitzpatrick et al.
patent: 4899205 (1990-02-01), Hamdy et al.
patent: 4910418 (1990-03-01), Graham et al.
patent: 4914055 (1990-04-01), Gordon et al.
patent: 4915983 (1990-04-01), Lake et al.
patent: 4916809 (1990-04-01), Boudou et al.
patent: 4920454 (1990-04-01), Stopper et al.
patent: 4924287 (1990-05-01), Orbach
patent: 4933738 (1990-06-01), Orbach et al.
patent: 4935584 (1990-06-01), Boggs
patent: 4937475 (1990-06-01), Rhodes et al.
patent: 4940181 (1990-07-01), Juskey, Jr. et al.
patent: 4943538 (1990-07-01), Mohsen et al.
patent: 4949084 (1990-08-01), Schwartz et al.
patent: 4969124 (1990-11-01), Luich et al.
patent: 4974048 (1990-11-01), Chakravorty et al.
patent: 4977357 (1990-12-01), Shrier
patent: 4992333 (1991-02-01), Hyatt
patent: 5003486 (1991-03-01), Hendel et al.
patent: 5014002 (1991-05-01), Wiscombe et al.
patent: 5027191 (1991-06-01), Bourdelaise et al.
patent: 5030113 (1991-07-01), Wilson
patent: 5055321 (1991-10-01), Enomoto et al.
patent: 5055973 (1991-10-01), Mohsen
patent: 5060116 (1991-10-01), Grobman et al.
patent: 5068634 (1991-11-01), Shrier
patent: 5077451 (1991-12-01), Mohsen
patent: 5087589 (1992-02-01), Chapman et al.
patent: 5092032 (1992-03-01), Murakami
patent: 5097593 (1992-03-01), Jones et al.
patent: 5099149 (1992-03-01), Smith
patent: 5099380 (1992-03-01), Childers et al.
patent: 5106773 (1992-04-01), Chen et al.
patent: 5108541 (1992-04-01), Schneider et al.
patent: 5120679 (1992-06-01), Boardman et al.
patent: 5142263 (1992-08-01), Childers et al.
patent: 5144567 (1992-09-01), Oelsch et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148355 (1992-09-01), Lowe et al.
patent: 5155577 (1992-10-01), Chance et al.
patent: 5159535 (1992-10-01), Desai et al.
patent: 5166556 (1992-11-01), Hsu et al.
patent: 5170931 (1992-12-01), Desai et al.
patent: 5181096 (1993-01-01), Forouhi
patent: 5181859 (1993-01-01), Foreman et al.
patent: 5189387 (1993-02-01), Childers et al.
patent: 5196724 (1993-03-01), Gordon et al.
patent: 5200652 (1993-04-01), Lee
patent: 5216278 (1993-06-01), Lin et al.
patent: 5218679 (1993-06-01), Hasegawa et al.
patent: 5220490 (1993-06-01), Weigler et al.
patent: 5229549 (1993-07-01), Yamakawa et al.
patent: 5233217 (1993-08-01), Dixit et al.
patent: 5248517 (1993-09-01), Shrier et al.
patent: 5250228 (1993-10-01), Baigrie et al.
patent: 5250470 (1993-10-01), Yamaguchi
patent: 5258643 (1993-11-01), Cohen
patent: 5260519 (1993-11-01), Knickerbocker et al.
patent: 5260848 (1993-11-01), Childers
patent: 5262754 (1993-11-01), Collins
patent: 5264729 (1993-11-01), Rostoker et al.
patent: 5282271 (1994-01-01), Hsieh et al.
patent: 5282312 (1994-02-01), DiStefano et al.
patent: 5291062 (1994-03-01), Higgins, III
patent: 5294750 (1994-03-01), Sakai et al.
patent: 5300208 (1994-04-01), Angelopoulos et al.
patent: 5311053 (1994-05-01), Law et al.
patent: 5317801 (1994-06-01), Tanaka et al.
patent: 5319238 (1994-06-01), Gordon et al.
patent: 5321322 (1994-06-01), Verheyen et al.
patent: 5329153 (1994-07-01), Dixit
patent: 5347258 (1994-09-01), Howard et al.
patent: 5349248 (1994-09-01), Parlour et al.
patent: 5362676 (1994-11-01), Gordon et al.
patent: 5367764 (1994-11-01), DiStefano et al.
patent: 5377124 (1994-12-01), Mohsen
patent: 5397921 (1995-03-01), Karnezos
patent: 5402318 (1995-03-01), Otsuka et al.
patent: 5404637 (1995-04-01), Kawakami
patent: 5409865 (1995-04-01), Karnezos
patent: 5410806 (1995-05-01), Schneider
patent: 5420456 (1995-05-01), Galbi et al.
patent: 5420460 (1995-05-01), Massingill
patent: 5435480 (1995-07-01), Hart et al.
patent: 5436412 (1995-07-01), Ahmad et al.
patent: 5438166 (1995-08-01), Carey et al.
patent: 5464790 (1995-11-01), Hawley
patent: 5468995 (1995-11-01), Higgins, III
patent: 5481795 (1996-01-01), Hatakeyama et al.
Chiang Steve S.
Jiang Hang
Lan James J. D.
Shepherd William H.
Wu Paul Y. F.
MacPherson Alan H.
Potter Roy
Prolinx Labs Corporation
Suryadevara Omkar K.
Thomas Tom
LandOfFree
Ball grid array structure and method for packaging an integrated does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ball grid array structure and method for packaging an integrated, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ball grid array structure and method for packaging an integrated will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1729272