LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks

Bonding alignment mark for bonds over active circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal

Bonding and encapsulated three dimensional hybrid integrated cir

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Bonding and probing pad structures

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Bonding and probing pad structures

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal

Bonding for a micro-electro-mechanical system (MEMS) and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Bonding layer in a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bonding lead structure with enhanced encapsulation

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Bonding material and circuit device using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Bonding method of flexible film and display bonded thereby

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Bonding of aluminum oxide components to silicons substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Bonding of integrated circuit chip to carrier using gold/tin eut

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Bonding of silicon carbide chip with a semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than...

Bonding of silicon carbide directly to a semiconductor substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Bonding of silicon wafers

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Bonding over integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Bonding pad

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Bonding pad and chip structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead

Bonding pad and method for manufacturing it

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead

Bonding pad and method for manufacturing it