Bonding method of flexible film and display bonded thereby

Details Bonding method of flexible film and display bonded thereby Bonding method of flexible film and display bonded thereby

2005-06-30

2008-12-02

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S736000, C257S786000, C257SE23027, C257SE23025, C349S149000

Reexamination Certificate

active

07459789

ABSTRACT:
A bonding method of a flexible film is provided, which includes: positioning an anisotropic conductive film on a plurality of first signal lines formed on the flexible film to be bonded to a thin film transistor (TFT) panel; arranging the anisotropic conductive film on the TFT panel to align the first signal lines formed on the flexible film and a plurality of second signal lines formed on the TFT panel; positioning at least one portion of a protection film for protecting the second signal lines of the flexible film to be overlapped with the TFT panel; and pressing the flexible film and the TFT panel.

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