Bonding material and circuit device using the same

Details Bonding material and circuit device using the same Bonding material and circuit device using the same

2007-05-29

2007-05-29

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S779000, C257S781000, C257S782000, C257S762000, C257S765000, C257S766000, C257SE23015, C257SE21508, C257SE21509, C257SE21519

Reexamination Certificate

active

10925182

ABSTRACT:
A circuit device is provided in which the bonding reliability of a brazing material such as soft solder is improved. A circuit device of the present invention includes conductive patterns, a bonding material which fixes circuit elements to the conductive patterns, and sealing resin which covers the circuit elements. The circuit device has a structure in which Pb-free solder containing Bi is used as the bonding material. Since the melting temperature of Bi is high in comparison with that of a general solder, the melting of the bonding material is suppressed when the circuit device is mounted. Further, Ag or the like may be mixed into the bonding material in order to enhance the wettability of the bonding material.

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