Bonding and encapsulated three dimensional hybrid integrated cir

Details Bonding and encapsulated three dimensional hybrid integrated cir Bonding and encapsulated three dimensional hybrid integrated cir

1993-08-04

1995-09-26

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

257415, 257431, 257432, 257433, 257434, H01L 29161, H01L 3300, H01L 2302

Patent

active

054536383

ABSTRACT:
System for packaging integrated circuits, especially sensors, in a housing, which also comprises multicontact bondings, especially hybrid ICs for three-dimensional arrangement of modules, wherein sensors (4, 5) are arranged at an angle in relation to one another on the base plate or the substrate (1). The sensors are contained in the single housing together with contact pins (pins) (2), and are connected in one plane by automatic bonding.

REFERENCES:
patent: 4585300 (1986-04-01), Landis et al.
patent: 4768070 (1988-08-01), Takizawa

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