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Selected: B

Bondable compliant pads for packaging of a semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Bonded anisotropic conductive film

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Bonded assembly having improved adhesive bond strength

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Bonded assembly having improved adhesive bond strength

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Bonded IC substrate with a high breakdown voltage and large curr

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Patent

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Bonded semiconductor integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

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Bonded SOI for floating body and metal gettering control

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Bonded SOI substrate, and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Bonded structure and bonding method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Bonded structure using conductive adhesives, and a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Bonded substrate for an integrated circuit containing a...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Bonded substrate structures and method for fabricating...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Bonded wafer

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Patent

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Bonded wafer and method of producing bonded wafer

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Bonded wafer and method of producing bonded wafer

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Bonded wafer package module

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate

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Bonded wafer processing

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Patent

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Bonded wafer structure having a buried insulation layer

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material
Patent

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Bonded wafer with metal silicidation

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Bonded wafer, process for producing same and substrate

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate

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