Bonded semiconductor integrated circuit device

Details Bonded semiconductor integrated circuit device Bonded semiconductor integrated circuit device

1997-08-26

1999-07-13

Hardy, David B.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

257786, H01L 23538

Patent

active

059230916

ABSTRACT:
Cells and wiring patterns constituting a single integrated circuit device are divided into two or more parts to be formed on two or more semiconductor chips, respectively. The semiconductor chips are bonded face-to-face to each other so that the I/O pins of the cells are connected to each other. Thus, the length of the wiring pattern connecting the cells to each other can be shortened.

REFERENCES:
patent: 4797723 (1989-01-01), Nishimura et al.

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