LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

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BGA package and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA package and method of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA package and method of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA package board and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA package having half-etched bonding pad and cut plating...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA package having substrate with patterned solder mask...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA package substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA package using PCB and tape in a die-up configuration

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA package with concave shaped bonding pads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA package with same power ballout assignment for wire...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA semiconductor chip package and mounting structure thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA semiconductor chip package and mounting structure thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA semiconductor device using insulating film

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA substrate via structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA substrate via structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA type semiconductor device and electronic equipment using the

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA type semiconductor device and electronic equipment using...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA type semiconductor device and electronic equipment using...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA type semiconductor device and electronic equipment using...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA type semiconductor device having a solder-flow...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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