Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent
1998-11-18
2000-05-30
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
257668, 257686, 257700, 257738, 257783, H01L 2352
Patent
active
060694076
ABSTRACT:
A die-up configuration includes a rigid circuit board with electrically conductive plated-through holes formed therethrough and an integrated-circuit die mounted to the upper surface of which a flexible insulated tape layer is fixed to the upper surface of a rigid circuit board and which has a number of wire-bonding sites. Conductive vias or plated-through holes are provided for connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to the contact areas formed on the lower surface of the flexible insulated tape layer. Conductors are provided for connecting respective contact areas on the lower surface of the flexible insulated tape layer to solder balls on the bottom of the rigid circuit board.
REFERENCES:
patent: 5404044 (1995-04-01), Booth et al.
patent: 5530288 (1996-06-01), Stone
patent: 5640051 (1997-06-01), Tomura et al.
patent: 5763939 (1998-06-01), Yamashita
patent: 5783865 (1998-07-01), Highashiguchi et al.
patent: 5909058 (1999-06-01), Yano et al.
patent: 5999415 (1999-12-01), Hamzedoost
Chambliss Alonzo
Chaudhuri Olik
King Patrick T.
VLSI Technology Inc.
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