BGA package with same power ballout assignment for wire...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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Details

C257S784000

Reexamination Certificate

active

07030502

ABSTRACT:
A wire bonding BGA package. On a conductive metal layer of a substrate used for carrying a die, a power ring for providing an operating voltage to a core circuit of the die is disposed in the inner side of a power ring for providing an operating voltage to an input/output circuit of the die. When the die is packaged by flip chip packaging instead of wire bonding packaging, the power ballout assignment of the BGA package is unchanged and is suitable for matching with an original circuit board used for the flip chip BGA package. In addition, the present invention provides a flip chip BGA package. When the die is packaged by wire bonding packaging instead of flip chip packaging, the power ballout assignment of the BGA package is unchanged and is suitable for matching with an original circuit board used for the wire bonding BGA package.

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