BGA package board and method for manufacturing the same

Details BGA package board and method for manufacturing the same BGA package board and method for manufacturing the same

2004-10-20

2008-08-05

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257SE21508

Reexamination Certificate

active

07408261

ABSTRACT:
Disclosed herein is a Ball Grid Array (BGA) package board. The BGA package board includes a first external layer on which a pattern comprising a circuit pattern and a wire bonding pad pattern is formed, a second external layer on which a pattern comprising a circuit pattern and a solder ball pad pattern is formed, an insulating layer formed between the first and second external layers, a first outer via hole to electrically connect the first and second external layers to each other, and a solder resist layer formed on each of the first and second external layers, with portions of the solder resist layer corresponding to the wire bonding pad pattern and the solder ball pad pattern being opened. The solder ball pad pattern is thinner than the circuit pattern of the second external layer.

REFERENCES:
patent: 5943212 (1999-08-01), Horiuchi et al.
patent: 6372540 (2002-04-01), Huemoeller
patent: 6828510 (2004-12-01), Asai et al.
patent: 2003/0001256 (2003-01-01), Sato et al.
patent: 2004/0113244 (2004-06-01), Shin et al.
patent: 11-040940 (1999-02-01), None
patent: 2004-172519 (2004-06-01), None
patent: 010056391 (2001-07-01), None

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