BGA type semiconductor device and electronic equipment using the

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

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257692, H01L 2352

Patent

active

061630713

ABSTRACT:
A BGA type semiconductor device which realizes its high speed operation and high integration density by shortening power supply or grounding wires to reduce its inductance. In the BGA type semiconductor device, the power supply or grounding wires are provided in the vicinity of the center of a BGA board to realize the high-speed operation and high integration density, whereby an electronic circuit or equipment using the BGA type semiconductor device can be made high in operational speed and made sophisticated in function.

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