BGA package with concave shaped bonding pads

Details BGA package with concave shaped bonding pads BGA package with concave shaped bonding pads

2005-04-13

2008-08-19

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S781000, C257S786000, C257SE23020, C361S767000, C361S777000, C361S808000

Reexamination Certificate

active

07414317

ABSTRACT:
In the BGA package and its manufacturing method, a bonding pad is etched from the exposed surface to a part of the insulation layer-coated region so as to form a solder contact side having a dish configuration, which is planar at a bottom center and slanted at a periphery. With this bent structure of the dish configuration, the bonding pad provides an increased bonding area for the solder, so that the BGA package substrate is enhanced in reliability.

REFERENCES:
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patent: 5196726 (1993-03-01), Nishiguchi et al.
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patent: 6622907 (2003-09-01), Fanti et al.
patent: 7081402 (2006-07-01), Hsu et al.
patent: 2003/0178229 (2003-09-01), Toyoda et al.
patent: 11-040940 (1999-02-01), None
patent: 457671 (2001-10-01), None
patent: 224387 (2004-11-01), None

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