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Semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Semiconductor package and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Semiconductor package and fabrication method of the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Semiconductor package and fabrication method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Semiconductor package and lead frame therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Semiconductor package and lead frame therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Semiconductor package and leadframe therefor having angled...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Semiconductor package and leadframe with horizontal leads...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Semiconductor package and method

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Semiconductor package and method for assembling the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Patent

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Semiconductor package and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Semiconductor package and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Semiconductor package and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Semiconductor package and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Semiconductor package and method of making using leadframe...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Semiconductor package and process for making the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Semiconductor package and stack arrangement thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Semiconductor package and trenched semiconductor power...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Semiconductor package assembly and method for electrically...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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