Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1995-03-23
1995-11-28
Wojciechowicz, Edward
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257670, 257672, 257735, 257773, 257783, 257787, 437180, 437182, 437211, 437224, H01L 2348, H01L 2144
Patent
active
054710880
ABSTRACT:
A semiconductor package having lead bars provided with upper and lower surfaces outwardly exposed, thereby enabling a stacked mounting, a memory extension and a reduction in mounting area.
The semiconductor package is manufactured by attaching a plurality of lead bars arranged in two rows in a facing manner to an upper surface of an adhesive tape, each of the lead bars having a first step and a second step positioned at a higher level than the first step, attaching a semiconductor chip to the first steps of the lead bars by an insulating adhesive, wire-bonding bond pads of the semiconductor chip with the second steps of the lead bars by metal wires, respectively, molding the lead bars, the semiconductor chip and the metal wires together by a molding compound under a condition that upper and lower surfaces of the lead bars are exposed outwardly of the molding compound, and removing the adhesive tape after the molding step.
REFERENCES:
patent: 4649415 (1987-03-01), Hebert
patent: 5166772 (1992-11-01), Soldner et al.
patent: 5227232 (1993-07-01), Lim
patent: 5233221 (1993-08-01), Bregman et al.
patent: 5334873 (1994-08-01), Cha
Goldstar Electron Co. Ltd.
Wojciechowicz Edward
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