Semiconductor package and leadframe therefor having angled...

Details Semiconductor package and leadframe therefor having angled... Semiconductor package and leadframe therefor having angled...

2007-07-24

2007-07-24

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S773000, C257S775000, C257S784000, C361S808000, C361S813000

Reexamination Certificate

active

11491664

ABSTRACT:
A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the encapsulation material of the semiconductor package.

REFERENCES:
patent: 5233222 (1993-08-01), Djennas et al.
patent: 6841854 (2005-01-01), Itou et al.
patent: 6924548 (2005-08-01), Hasebe et al.
patent: 7105378 (2006-09-01), Ng et al.
patent: 11074440 (1999-03-01), None

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