Semiconductor package and process for making the same

Details Semiconductor package and process for making the same Semiconductor package and process for making the same

2007-10-16

2007-10-16

Jackson, Jerome (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S734000, C257S777000, C257SE23031, C257SE23037, C257SE23039, C438S123000, C438S106000

Reexamination Certificate

active

11332891

ABSTRACT:
A semiconductor package mainly includes a leadframe and a first semiconductor chip such as an application specific integrated circuit (ASIC) encapsulated in a first package body having a cavity for receiving a second semiconductor chip such as a pressure sensor chip, and a cover disposed over the cavity of the first package body. At least a portion of the first package body is formed between the second semiconductor chip and the die pad such that the second semiconductor chip is directly disposed on the portion of the first package body instead of the die pad.

REFERENCES:
patent: 4352735 (1982-10-01), Turetsky
patent: 5343076 (1994-08-01), Katayama et al.
patent: 5523608 (1996-06-01), Kitaoka et al.
patent: 5859759 (1999-01-01), Moriyama et al.
patent: 6683370 (2004-01-01), McDonald et al.
patent: 6821817 (2004-11-01), Thamby et al.
patent: 6927482 (2005-08-01), Kim et al.
patent: WO 2005/038422 (2005-04-01), None

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