Semiconductor package and trenched semiconductor power...

Details Semiconductor package and trenched semiconductor power... Semiconductor package and trenched semiconductor power...

2008-06-26

2010-11-02

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

C257S737000, C257S738000, C257S686000, C257S777000, C257S778000

Reexamination Certificate

active

07825499

ABSTRACT:
A semiconductor package60in which a region where a land pad18is formed is provided on an outer side of a region in which a flip-chip connecting pad16is formed, wherein a protecting member39is formed to expose the land pad18in the region in which the land pad18is formed, and the protecting member39includes a frame-shaped structure portion39A disposed to surround the flip-chip connecting pad16and a support film portion39B disposed on an outer side of the frame-shaped structure portion39A, and a semiconductor device70using the semiconductor package60.

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