Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate
2006-09-05
2006-09-05
Graybill, David E. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With bumps on ends of lead fingers to connect to semiconductor
C257SE23043, C257SE23046, C438S108000
Reexamination Certificate
active
07102216
ABSTRACT:
A leadframe, a semiconductor package, and methods of making the same are disclosed. A leadframe includes leads having an inner end segment. A first subset of the leads include a recess in a first surface of the inner end segment. A second subset of the leads include a recess in an opposite second surface of the inner end segment. The first subset leads are in an alternating lateral pattern with the second subset leads such that the recess of adjacent inner end segments are oriented in opposite directions. The recesses separate adjacent inner end segments in a vertical direction, thereby eliminating or reducing a need for horizontal spacing between adjacent inner end segments. In a semiconductor package, a semiconductor chip is electrically connected by a bond wire to the inner end segment of the leads. The bond wire is bonded within the recess of alternating leads.
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Amkor Technology Inc.
Graybill David E.
Stetina Brunda Garred & Brucker
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