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Selected: M

Micro lead frame packages and methods of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Reexamination Certificate

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Micro sensor and method for making same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent

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Micro-BGA beam lead connection with cantilevered beam leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Micro-sensor and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
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Microarray lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Microelectronic assemblies incorporating inductors

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Microelectronic assembly formation with lead displacement

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Microelectronic component assemblies and microelectronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Microelectronic component assemblies and microelectronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Microelectronic component assemblies and microelectronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Microelectronic die assembly having thermally conductive...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
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Microelectronic package having a compliant layer with bumped...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
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Microelectronic package having a stiffening element and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Microelectronic package having a stiffening element and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Microelectronic packages having an array of resilient leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With means for controlling lead tension
Reexamination Certificate

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Microelectronic substrate with integrated devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Microelectronic substrates with integrated devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Miniaturized integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Modified bus bar with Kapton tape or insulative material on...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Modified bus bar with Kapton.TM. tape or insulative material on

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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