Micro sensor and method for making same

Details Micro sensor and method for making same Micro sensor and method for making same

1997-04-17

2000-09-26

Williams, Alexander O.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257687, 257728, 257724, 257721, 257714, 257738, 257777, H01L 2302, H01L 2904, H01L 2348, B32B 900

Patent

active

06124631&

ABSTRACT:
The invention concerns a device comprising a first substrate and a second substrate intended to form a micro-system such as a sensor, at least one of the substrates being able to include electronic circuit components. The invention is characterised in that a layer of polymer is interposed between the first and the second substrate, in that the polymer layer includes at least one cavity which extends from the first to the second substrate and in that solder attaching means are provided in the cavity, said solder means assuring a traction resistant mechanical connection between the two substrates.

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