Micro-sensor and manufacturing method thereof

Details Micro-sensor and manufacturing method thereof Micro-sensor and manufacturing method thereof

2011-01-11

2011-01-11

Bryant, Kiesha R (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C361S748000

Reexamination Certificate

active

07868429

ABSTRACT:
The micro-sensor for a micro image pick-up device includes a flexible circuit board and a circuit substrate. The flexible circuit board has an opening exposing an end of a plurality of metal wires. An image sensing device that electrically connected to a plurality of printed wires disposed on the circuit substrate. The circuit substrate is disposed at the opening of the flexible circuit board. The plurality of printed wires on the circuit substrate corresponds to and contacts the end of the plurality of metal wires exposed out of the flexible circuit board. With the design of the flexible circuit board, the steps of forming a plurality of wiring ducts on the circuit substrate and electrically connecting the printed wires of the circuit substrate by a plurality of connecting lines for transferring signals can be omitted.

REFERENCES:
patent: 6313456 (2001-11-01), Miyashita et al.
patent: 2004/0222352 (2004-11-01), Nishizawa
patent: 1993-261065 (1993-10-01), None
patent: 1997-192094 (1997-07-01), None

Affiliated with

Also associated with

Rating

Micro-sensor and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Micro-sensor and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micro-sensor and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2697123