IC having heat spreader attached by glob-topping

Details IC having heat spreader attached by glob-topping IC having heat spreader attached by glob-topping

1995-05-09

1996-12-03

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257790, 257796, H01L 23495

Patent

active

055811191

ABSTRACT:
A method is disclosed for packaging an integrated circuit having a heat spreader for cooling an integrated circuit die and glob-topping to both protect bonding wires and attach the heat spreader to a lead frame. The adhesion from glob-topping replaces that of double-sided tape in the prior art. The heat spreader includes an electrically insulating layer to replace the electrical insulation provided by double-sided tape in the prior art.

REFERENCES:
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patent: 5309322 (1994-05-01), Wagner et al.
patent: 5362680 (1994-11-01), Heinen et al.
patent: 5406124 (1995-04-01), Morita et al.
R. W. Nuter "High Density Interconnectable Package" IBM Technical Disclosure Bulletin vol. 16, No. 9 Feb. 1974 p. 2893.

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