Inlet for an electronic tag

Details Inlet for an electronic tag Inlet for an electronic tag

2006-06-16

2010-02-16

Lindsay, Jr., Walter L (Department: 2812)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C257S679000, C257S783000, C257SE23043, C257SE23124, C343S873000

Reexamination Certificate

active

07663209

ABSTRACT:
Provided are an inlet for an electronic tag comprising an insulating film, antennas each made of a conductor layer and formed over one surface of the insulating film, a slit formed in a portion of each of the antennas and having one end extending toward the outer edge of the antenna, a semiconductor chip electrically connected with each of the antennas via a plurality of bump electrodes, and a resin for sealing the semiconductor chip therewith; and a manufacturing process of the inlet. By the present invention, formation of a thin and highly-reliable inlet for a non-contact type electronic tag can be actualized.

REFERENCES:
patent: 4783646 (1988-11-01), Matsuzaki
patent: 5786626 (1998-07-01), Brady et al.
patent: 5826328 (1998-10-01), Brady et al.
patent: 5903239 (1999-05-01), Takahashi et al.
patent: 5973600 (1999-10-01), Mosher
patent: 6060959 (2000-05-01), Yakuwa
patent: 6180433 (2001-01-01), Furey et al.
patent: 6794727 (2004-09-01), Leduc et al.
patent: 2003/0169204 (2003-09-01), Saito
patent: 1213449 (1999-04-01), None
patent: 10-13296 (1998-01-01), None

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