Inline integrated circuit system

Details Inline integrated circuit system Inline integrated circuit system

2011-06-28

2011-06-28

Menz, Douglas M (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

C257S666000

Reexamination Certificate

active

07968981

ABSTRACT:
An integrated circuit package system including: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe.

REFERENCES:
patent: 2007/0090495 (2007-04-01), Kim et al.
patent: 2008/0230883 (2008-09-01), Yee et al.

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