Inexpensive resin molded semiconductor device

Details Inexpensive resin molded semiconductor device Inexpensive resin molded semiconductor device

1997-07-16

1999-11-09

Kelley, Nathan K.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257738, 257697, H01L 23495

Patent

active

059820268

ABSTRACT:
In a resin molded semiconductor device, a metal lead frame includes an island and leads, and the leads have bulged terminal portions. Also, a semiconductor chip is mounted on the island, and external terminals are adhered to the bulged terminal portions opposite to the semiconductor chip. Further, an envelope of resin encapsulates the metal lead frame, the semiconductor chip and a part of each of the external terminals.

REFERENCES:
patent: 5045921 (1991-09-01), Lin et al.
patent: 5293072 (1994-03-01), Tsuji et al.
patent: 5317188 (1994-05-01), Kondou
patent: 5389739 (1995-02-01), Mills
patent: 5663593 (1997-09-01), Mostafazadeh et al.
patent: 5663594 (1997-09-01), Kimura
patent: 5668405 (1997-09-01), Yamashita
patent: 5677566 (1997-10-01), King et al.
patent: 5717252 (1998-02-01), Nakashima et al.
patent: 5729051 (1998-03-01), Nakamura

Affiliated with

Also associated with

Rating

Inexpensive resin molded semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Inexpensive resin molded semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Inexpensive resin molded semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1460311