Inexpensive resin molded semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257738, 257697, H01L 23495

Patent

active

059820268

ABSTRACT:
In a resin molded semiconductor device, a metal lead frame includes an island and leads, and the leads have bulged terminal portions. Also, a semiconductor chip is mounted on the island, and external terminals are adhered to the bulged terminal portions opposite to the semiconductor chip. Further, an envelope of resin encapsulates the metal lead frame, the semiconductor chip and a part of each of the external terminals.

REFERENCES:
patent: 5045921 (1991-09-01), Lin et al.
patent: 5293072 (1994-03-01), Tsuji et al.
patent: 5317188 (1994-05-01), Kondou
patent: 5389739 (1995-02-01), Mills
patent: 5663593 (1997-09-01), Mostafazadeh et al.
patent: 5663594 (1997-09-01), Kimura
patent: 5668405 (1997-09-01), Yamashita
patent: 5677566 (1997-10-01), King et al.
patent: 5717252 (1998-02-01), Nakashima et al.
patent: 5729051 (1998-03-01), Nakamura

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Inexpensive resin molded semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Inexpensive resin molded semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Inexpensive resin molded semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1460311

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.