IC card including frame with lateral hole for injecting encapsul

Details IC card including frame with lateral hole for injecting encapsul IC card including frame with lateral hole for injecting encapsul

1993-09-16

1995-05-16

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257787, 257704, 257710, H01L 2328

Patent

active

054163587

ABSTRACT:
An IC card includes: a circuit board on which functional components are mounted; and a frame covered with a thin plate, the circuit board being disposed in the frame, the inside of the frame being filled with a foamed resin. As a result of the above arrangement, an IC card having a strong resistance to various external forces is produced. Furthermore, because it is possible to incorporate a surface material with a design in an integrally molded device, thus it is also possible to produce an IC card device having an excellent appearance.

REFERENCES:
patent: 4303934 (1981-12-01), Stitt
patent: 5173841 (1992-12-01), Uenaka et al.
patent: 5184209 (1993-02-01), Kodai et al.
patent: 5189638 (1993-02-01), Kimura
patent: 5210442 (1993-05-01), Ishimoto

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