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Drop-in heat sink package with window frame flag

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Drop-mold conformable material as an encapsulation for an...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Dual channel small outline optocoupler package and method thereo

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Dual chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Dual gauge leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Dual leadframe package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Dual LOC semiconductor assembly employing floating lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Dual row leadframe and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Dual row leadframe and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Dual side cooling integrated power device package and module...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Dual sided integrated circuit chip package with offset wire bond

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Dual-chip integrated circuit package and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Dual-chip integrated circuit package with a chip-die pad...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Dual-chip integrated circuit package with unaligned chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Dual-die integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Duel die package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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