Built-in stress pattern on IC dies and method of forming
Composite lead frame
Composite lead frame with connected inner and outer leads
Coupling spaced bond pads to a contact
Coupling spaced bond pads to a contact
Downset lead frame for semiconductor packages
Electronic module for data cards
Electronic package for isolated circuits
High pin count and multi-layer wiring lead frame
Hybrid integrated circuit
Integrated circuit package
Lead frame
Lead frame and production method thereof, and semiconductor...
Lead frame and semiconductor device using same
Lead frame for a semiconductor device, a semiconductor...
Lead frame for semiconductor device and semiconductor device...
Lead frames including extended tie-bars, and semiconductor chip
Lead-on-chip type semiconductor device having thin plate and met
Metallic leadframes having laser-treated surfaces for...
Method and apparatus for connecting vertically stacked...