Lead frames including extended tie-bars, and semiconductor chip

Details Lead frames including extended tie-bars, and semiconductor chip Lead frames including extended tie-bars, and semiconductor chip

1996-06-28

1998-09-22

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Small lead frame for connecting a large lead frame to a...

257666, 257668, 257676, 257692, 257696, H01L 2328, H01L 2944, H01L 2348, H01L 2350

Patent

active

058118756

ABSTRACT:
Lead frames for semiconductor chips include spaced apart tie-bars which extend to contact and support the semiconductor chip. Adhesive is used between the tie-bars and the chip to adhesively couple the tie-bars to the chip. The lead frame leads therefore need not be used to adhesively couple the chip to the lead frame, thereby reducing or eliminating the need for equal spacing and close coupling of the leads, and reducing or preventing problems caused by deterioration of adhesive on the leads. The tie-bars may include polyimide tape or liquid adhesive held in cups. During fabrication, a semiconductor chip is mounted on the adhesive material, such that the tie-bars mechanically support the semiconductor chip and the lead ends extend adjacent the semiconductor chip. The lead ends are then electrically connected to the semiconductor chip and the package is encapsulated.

REFERENCES:
patent: 4862245 (1989-08-01), Pashby et al.
patent: 5198883 (1993-03-01), Takahashi et al.
patent: 5227661 (1993-07-01), Heinen
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5334873 (1994-08-01), Cha
patent: 5357139 (1994-10-01), Yaguchi et al.
patent: 5545921 (1996-08-01), Conru et al.
patent: 5637915 (1997-06-01), Sato et al.
patent: 5648682 (1997-07-01), Nakazawa et al.
patent: 5684328 (1997-11-01), Jin et al.

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