Metallic leadframes having laser-treated surfaces for...

Details Metallic leadframes having laser-treated surfaces for... Metallic leadframes having laser-treated surfaces for...

2009-06-22

2011-10-25

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Small lead frame for connecting a large lead frame to a...

C257S674000, C257S690000, C257SE23031, C257SE23045, C361S772000, C438S123000

Reexamination Certificate

active

08044495

ABSTRACT:
A leadframe for the assembly of a semiconductor chip has regions (112) with an original smooth surface of glossy appearance and regions (113, 114, 210) of a frosty appearance with rough surface contours. The regions of rough surface contours include two-dimensional arrays of spots (401) comprising a central area (402) below the original surface (400) and a piled ring (403) above the original surface. The piled ring (403) consists of the leadframe material in amorphous configuration.

REFERENCES:
patent: 6127206 (2000-10-01), Nakamichi
patent: 6197615 (2001-03-01), Song et al.
patent: 6670222 (2003-12-01), Brodsky
patent: 7109570 (2006-09-01), Manalac et al.
patent: 7262491 (2007-08-01), Islam et al.
patent: 2009/0230526 (2009-09-01), Chen et al.

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